ABOUT YOKATTA
Company Profile
YOKATTA TECHNOLOGY
Founded in 2010, YOKATTA Technology specializes in the semiconductor, IC substrate, advanced packaging and electronics manufacturing industries, providing advanced materials, equipment, process technologies and integrated solutions.
Over the years, we have built strong partnerships with technology providers across Japan, Korea, Taiwan and other global markets, bringing competitive materials, equipment and innovative technologies to our customers. From requirement analysis and product selection to sample evaluation, technical qualification, mass-production implementation and ongoing technical support, YOKATTA provides responsive and professional local services throughout the entire introduction process.
We are more than a product distributor — we are an integration partner connecting technologies, suppliers and customer needs.
As AI, high-performance computing (HPC), advanced packaging, chiplet architectures, glass core technologies, next-generation semiconductors and smart manufacturing continue to reshape the industry, YOKATTA continuously expands its portfolio of advanced materials, equipment and process technologies to help customers improve manufacturing efficiency, product quality and supply-chain competitiveness.
With extensive semiconductor industry experience, a global partnership network and strong local market capabilities, we are committed to building long-term, trusted relationships among our customers, technology partners and YOKATTA — transforming innovative technologies into sustainable competitive advantages.