Glass Technology for Next-Generation Advanced Packaging

As AI, high-performance computing (HPC), chiplets and heterogeneous integration continue to evolve, advanced packaging requires larger package sizes, higher interconnect density and finer circuit geometries. Dimensional stability, flatness and warpage control are therefore becoming increasingly critical for substrate technologies.

Glass Core leverages the excellent dimensional stability, flatness and material properties of glass to provide an emerging substrate platform for next-generation high-density packaging.

When integrated with TGV (Through-Glass Via) and precision glass processing technologies, Glass Core can enable high-density vertical interconnects for chiplet, 2.5D/3D, AI/HPC and other advanced packaging architectures.

YOKATTA works with international glass technology partners and provides local technical support covering glass materials, precision processing, TGV technologies, sample evaluation and technical qualification to help customers explore next-generation glass substrate applications.

Technical Advantages

High Dimensional Stability
Supports dimensional control and process stability for large-format and high-density packaging.

Low Warpage Potential
Glass material properties provide advantages for warpage management in advanced packaging structures.

Excellent Flatness
Suitable for precision processing and high-density interconnect applications.

Tailored CTE
Glass compositions can be selected to meet different thermal expansion requirements.

Fine-Line Capability
Offers potential for fine-line / fine-space structures and higher I/O density.

TGV Integration
Supports Through-Glass Via structures for high-density vertical interconnections.